California NanoSystems Institute
CNSI
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Rob Candler, Ph.D.

   
Assistant Professor, Electrical Engineering
Member, California NanoSystems Institute

Education:
Degrees:
Ph.D., Stanford University, 2006
M.S., Stanford University, 2002
B.S., Electrical Engineering, 2000

Honors and Awards:
2000 Stanford University, College of Engineering Fellowship
2000 Auburn University, Most Outstanding EECS Engineering Student
2000 Auburn University, Most Outstanding Student in College of Engineering
2000 National Defense, Science and Engineering Graduate Fellowship
2000 National Science Foundation, Graduate Fellowship

Contact Information:
Email Address: rcandler@ee.ucla.edu
Work Email Address: rcandler@ee.ucla.edu
Mailing Address: UCLA Elec Engr
BOX 951594, 6731-H BH
Los Angeles, CA 90095
UNITED STATES
Home Page: http://www.ee.ucla.edu/~rcandler/index.html
Fax Number: 310-794-1592 Fax
Office Phone Number: 310-825-7346 Office
Work Phone Number: 310-825-2214 Assistant's phone number
310-825-4161
Technical Research Interest:

Nano/Microelectromechanical Systems (N/MEMS) design and sensing applications,

micro/nanoscale analysis of surface phenomena, energy harvesting, micromechanical

resonators and inertial sensors, sensors for biomedical applications, packaging of MEMS/NEMS devices.

Rob Candler’s research interests are in the design, modeling, and technology development of micro/nanosystems, fundamental limitations of N/MEMS, and the interface of microsystems with biology.

Prior to joining UCLA, Candler was a senior MEMS research engineer at Bosch Research and Technology Center in Palo Alto, California and a consulting assistant professor at Stanford University. As a senior research engineer at Bosch Research, Candler collaborated with major research universities on joint projects (bioMEMS, stiction/adhesion, & sensor drift) including leading Bosch participation in DARPA-funded project: Science andTechnology Fundamentals); Evaluated and developed technologies for future products in automobile safety (e.g., air-bag and traction control) and consumer applications (e.g., gaming and mobile phones); and was a resident engineer at SiTime, a MEMS oscillator startup company, working on research projects of common benefit to SiTime and Bosch.


Additional Information:

Professor Candler was born in 1977 in Auburn, AL. He has two brothers. Will, his older brother, is a law student at Duke University. Sam, his younger brother, is currently an undergraduate at Auburn University studying electrical engineering. Carla, his mother, is an organist, while Bill, his father, is a psychologist for the VA.

Selected Publications:

Kim J, Hong AJ, Kim SM, Shin KS, Song EB, Hwang Y, Xiu F, Galatsis K, Chui CO, Candler RN, Choi S, Moon JT, Wang KL, A stacked memory device on logic 3D technology for ultra-high-density data storage, Nanotechnology, 2011, 22 (25), 254006.
Tsai, K.L., Ziaei-Moayyed, M., Candler, R.N., Wei Hu, Brand, V., Klejwa, N., Wang, S.X., Howe, R.T., Magnetic, Mechanical, and Optical Characterization of a Magnetic Nanoparticle-Embedded Polymer for Microactuation, Journal of Microelectromechanical Systems, 2011, 20 (1), 65-72.
Yoneoka, S.; Roper, C.S.; Candler, R.N.; Chandorkar, S.A.; Graham, A.B.; Provine, J.; Maboudian, R.; Howe, R.T.; Kenny, T.W., Characterization of Encapsulated Micromechanical Resonators Sealed and Coated With Polycrystalline SiC, Journal of Microelectromechanical Systems , 2010, 19 (2), 357-66.
G. Bahl, R. Melamud, B. Kim, S. A. Chandorkar, J. C. Salvia, M. A. Hopcroft, D. Elata, R. G. Hennessy, R. N. Candler, R. T. Howe, T. W. Kenny, Model and Observations of Dielectric Charge in Thermally Oxidized Silicon Resonators, Journal of Microelectromechanical Systems, 2010, 19 (1), 162-174.
Candler, R.N.; Yongha Hwang; Feng Gao, Sensitivity enhancement of vapor sensors with porous silicon resonant structures, Proceedings of the SPIE, 2010, 7679, 76790K-7.
Weinberg, M.; Candler, R.; Chandorkar, S.; Varsanik, J.; Kenny, T.; Duwel, A., Energy loss in MEMS resonators and the impact on inertial and RF devices, Transducers 2009, 2009, 688-95.
B. Kim, R. N. Candler, R. Melamud, M. A. Hopcroft, S. Yoneoka, H. K. Lee, G. Yama, T. W. Kenny, Hermeticity and Diffusion Investigation in Polysilicon Film Encapsulation for Microelectromechanical Systems (MEMS), Journal of Applied Physics, 2009, 105.
S. A. Chandorkar, R. N. Candler, A. Duwel, R. Melamud, M. Agarwal, K. E. Goodson, and T. W. Kenny, Multimode thermoelastic dissipation, Journal of Applied Physics, 2009, 105 (4), 043505-043505-13.
Kim, B., Hopcroft, M. A., Candler, R. N., Jha, C. M., Agarwal, M.,Melamud, R., Chandorkar, S. A., Yama, G., Kenny, T. W., Temperature Dependence of Quality Factor in MEMS Resonators, Journal of Microelectromechanical Systems, 2008, 17 (3), 755-766.
Jha, C. M. Hopcroft, M. A. Chandorkar, S. A. Salvia, J. C. Agarwal, M. Candler, R. N. Melamud, R. Kim, B. Kenny, T. W., Thermal isolation of encapsulated MEMS resonators, Journal of Microelectromechanical Systems, 2008, 17 (1), 175-184.
M. Agarwal, K. K. Park, S. A. Chandorkar, R. N. Candler, B. Kim, M. A. Hopcroft, R. Melamud, T. W. Kenny, B. Murmann, Acceleration sensitivity in beam-type electrostatic microresonators, Applied Physics Letters, 2007, 90.
B. Kim, R. N. Candler, M. A. Hopcroft, M. Agarwal, W.-T. Park, T. W. Kenny, Frequency Stability of Wafer-scale Encapsulated Silicon Based MEMS Resonators, Sensors and Actuators, 2007, 136, 125-131 .
Bongsang, Kim Melamud, R. Hopcroft, M. A. Chandorkar, S. A. Bahl, G. Messana, M. Candler, R. N. Yama, G. Kenny, T., Si-SiO/sub 2/ composite MEMS resonators in CMOS compatible wafer-scale thin-film encapsulation, 2007 IEEE International Frequency Control Symposium Jointly with the 21st European Frequency and Time Forum, 2007, 1214-1219.
Park Woo-Tae, O'Connor Kevin N, Chen Kuan-Lin, Mallon Joseph R, Maetani Toshiki, Dalal Parmita, Candler Rob N, Ayanoor-Vitikkate Vipin, Roberson Joseph B, Puria Sunil, Kenny Thomas W, Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids, Biomedical microdevices, 2007, 9 (6), 939-49.
Woo-Tae, Park Partridge, A. Candler, R. N. Ayanoor-Vitikkate, V. Yama, G. Lutz, M. Kenny, T. W., Encapsulated submillimeter piezoresistive accelerometers, Journal of Microelectromechanical Systems, 2006, 15 (3), 507-514.
W.-T. Park, A. Partridge, R. N. Candler, V. Ayanoor-Vitikkate, G. Yama, M. Lutz, and T. W. Kenny, Encapsulated Submillimeter Piezoresistive Accelerometers, Journal of Microelectromechanical Systems, 2006, 15 (3), 507-514.
Duwel, A. Candler, R. N. Kenny, T. W. Varghese, M., Engineering MEMS resonators with low thermoelastic damping, Journal of Microelectromechanical Systems, 2006, 15 (6), 1437-1445.
A. Duwel, R. N. Candler, T. W. Kenny, and M. Varghese, Engineering MEMS Resonators with Low Thermoelastic Damping, Journal of Microelectromechanical Systems, 2006, 15 (6), 1437-1445.
Candler, R. N. Duwel, A. Varghese, M. Chandorkar, S. A. Hopcroft, M. A. Park, W. T. Kim, B. Yama, G. Partridge, A. Lutz, M. Kenny, T. W., Impact of geometry on thermoelastic dissipation in micromechanical resonant beams, Journal of Microelectromechanical Systems, 2006, 15 (4), 927-934.
R. N. Candler, M. Hopcroft, B. Kim, W.-T. Park, R. Melamud, M. Agarwal, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators, Journal of Microelectromechanical Systems, 2006, 15 (6), 1446-1456.
Candler, R. N. Hopcroft, M. A. Kim, B. Park, W. T. Melamud, R. Agarwal, M. Yama, G. Partridge, A. Lutz, M. Kenny, T. W., Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators, Journal of Microelectromechanical Systems, 2006, 15 (6), 1446-1456.
Woo-Tae, Park Candler, R. N. Ayanoor-Vitikkate, V. Lutz, M. Partridge, A. Yama, G. Kenny, T. W., Fully encapsulated sub-millimeter accelerometers, 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005, 347-350.
Candler, R. N., Stuff most students never ask about grad school, IEEE Potentials, 2005, 24 (3), 4-10.
Candler, R. N. Park, W. T. Li, H. M. Yama, G. Partridge, A. Lutz, M. Kenny, T. W., Single wafer encapsulation of MEMS devices, IEEE Transactions on Advanced Packaging , 2003, 26 (3), 227-232.